Muaj PCB electronics PCB siab TG170 12 txheej ENIG

High Layer PCB (High Layer PCB) yog PCB (Printed Circuit Board, luam tawm Circuit Board) nrog ntau tshaj 8 txheej. Vim nws qhov zoo ntawm ntau txheej Circuit Court board, ntau dua Circuit Court ceev yuav ua tiav nyob rau hauv ib tug me me hneev taw, enabling ntau complex Circuit Court tsim, yog li nws yog heev haum rau high-speed digital teeb liab ua, microwave xov tooj cua zaus, modem, high-end server, cov ntaub ntawv khaws cia thiab lwm qhov chaw. High-theem Circuit Court boards feem ntau yog ua los ntawm high-TG FR4 boards los yog lwm yam high-kev ua tau zoo substrate cov ntaub ntawv, uas muaj peev xwm tswj Circuit Court stability nyob rau hauv high-temperature, high humidity, thiab high-frequency ib puag ncig.

Hais txog TG qhov tseem ceeb ntawm FR4 cov ntaub ntawv

FR-4 substrate yog ib qho epoxy resin system, yog li ntawd rau lub sij hawm ntev, Tg tus nqi yog qhov feem ntau qhov Performance index siv los faib FR-4 substrate qib, kuj yog ib qho tseem ceeb ntawm kev ua tau zoo tshaj plaws hauv IPC-4101 specification, Tg tus nqi ntawm resin system, yog hais txog cov khoom los ntawm ib tug kuj nruj los yog "iav" lub xeev kom yooj yim deformed los yog softened lub xeev kub hloov point. Qhov kev hloov pauv thermodynamic no ib txwm thim rov qab yog tias cov resin tsis decompose. Qhov no txhais tau hais tias thaum cov khoom siv cua sov los ntawm chav tsev kub mus rau qhov kub siab tshaj Tg tus nqi, thiab tom qab ntawd txias hauv qab tus nqi Tg, nws tuaj yeem rov qab mus rau nws lub xeev nruj nrog cov khoom qub.

Txawm li cas los xij, thaum cov khoom raug rhuab mus rau qhov kub ntau dua li nws tus nqi Tg, lub xeev hloov tsis tau hloov pauv yuav tshwm sim. Cov nyhuv ntawm qhov kub thiab txias no muaj ntau yam ua rau cov khoom siv, thiab nrog rau cov thermal decomposition ntawm cov resin. Feem ntau hais lus, qhov siab dua Tg ntawm lub substrate, qhov siab dua qhov kev ntseeg ntawm cov khoom. Yog tias cov txheej txheem vuam tsis muaj txhuas tau txais, qhov thermal decomposition kub (Td) ntawm lub substrate yuav tsum tau txiav txim siab. Lwm qhov tseem ceeb ntawm kev ua tau zoo suav nrog thermal expansion coefficient (CTE), kev nqus dej, adhesion zog ntawm cov khoom, thiab feem ntau siv cov sij hawm txheej txheej xws li T260 thiab T288 kev xeem.

Qhov sib txawv tshaj plaws ntawm FR-4 cov ntaub ntawv yog Tg tus nqi. Raws li Tg kub, FR-4 PCB feem ntau muab faib ua Tg qis, nruab nrab Tg thiab siab Tg daim hlau. Hauv kev lag luam, FR-4 nrog Tg nyob ib ncig ntawm 135 ℃ feem ntau yog cais raws li qis Tg PCB; FR-4 ntawm txog 150 ℃ tau hloov mus rau hauv nruab nrab Tg PCB. FR-4 nrog Tg nyob ib ncig ntawm 170 ℃ tau cais raws li siab Tg PCB. Yog hais tias muaj ntau lub sij hawm nias, los yog PCB txheej (ntau tshaj 14 txheej), los yog siab vuam kub (≥230 ℃), los yog siab ua hauj lwm kub (ntau tshaj 100 ℃), los yog siab vuam thermal stress (xws li yoj soldering), siab Tg PCB yuav tsum xaiv.